Horizon Microtechnologies has developed a stencil-based 3D microfabrication technology that adds functionality to plastic micro-AM parts and has applications in the field of microelectromechanical systems (MEMS).
Andreas Frölich, CEO at Horizon says, “MEMS devices are also benefiting from the increasing demands for reliability and safety in electronic systems. With the ever-growing range of applications that MEMS are considered for, there is also a growing need for components that can withstand harsh environments or extreme conditions, fit a small form factor and operate reliably. MEMS devices need housings for a variety of reasons, and these housing are an essential part of the system since they constitute the interface of the actual MEMS to the rest of the device and the rest of the world.”
For one, the enclosure protects sensitive MEMS devices from physical damage and also helps keep dust and other contaminants away from the device that might otherwise interfere with its operation.
MEMS devices need housings that both protect against physical damage and contamination and accommodate all of the MEMS’ functions. The package must also allow for integration into larger systems and, if necessary, dissipate heat or provide electromagnetic shielding.
Using additive manufacturing (AM) to develop MEMS packages opens up numerous opportunities for manufacturers, such as design freedom and precision micron-scale manufacturing. Horizon has developed a coating technology that adds conductivity and environmental resistance to the functionality of micro-AM fabricated MEMS packages.
Frölich continues, “While additive manufacturing is not typically considered a mass-production technology, the reduction in the size of electronics and optics — and the accompanying shrinkage of packaging — has made micro-AM a viable production alternative for MEMS housings for small to medium batch sizes. In addition to the precision offered by micro-AM, and the ability to build geometrically complex housings, an intelligent use of our post-processes can increase the functionality of the packaging, for example by reducing stray light in the infrared, having integrated electrical conductors, or making an off-the-shelf MEMS system usable in a harsh environment by adapting the right packaging.”
Find out more about Horizon Microtechnologies at 3dmicrofabrication.com.
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