The Chinese smartphone brand Honor recently unveiled its latest foldable smartphone, the Honor Magic V2. With a thickness of 9.9 mm, it is said to be the thinnest foldable smartphone on the market. This is said to have been made possible in part by using Hanbang Technology’s (HBD) metal 3D printing technology to create the Luban titanium hinges.
The Honor Magic V2 has a number of improved features. For example, the new smartphone is equipped with a Qualcomm Snapdragon 8 Gen 2 SoC, and the 7.92-inch LTPO OLED has a resolution of 2,156 x 2,344 pixels with a refresh rate of 120 Hz. However, the biggest feature is the foldability of the display. With 3D printing, the size, weight as well as the quality could be increased.
The 3D-printed titanium hinges of the Honor Magic V2 brought a 27% reduction in width while increasing the strength by 150%. According to the manufacturer, it is the first cell phone to pass the Swiss SGS certification for high reliability and folding quality. This means that the 3D-printed titanium hinges can withstand 400,000 folding tests. Even after 200,000 folds, the screen fold only changes by 36μm, which is equivalent to a hair.
3D printers from HBD were used in the production. The company has provided metal 3D printing equipment and technologies, enabled a minimum part shape accuracy of ±0.025mm and a wall thickness of 0.2mm.
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